Profesor Oliver G. Schmidt

Director:

Prof. Dr. Oliver G. Schmidt
IFW Dresden
Postfach 27 01 16
D-01171 Dresden  

Contact: 

Office
Kristina Krummer
office-iin (at) ifw-dresden.de
Phone:+49 351 4659 810
Fax:+49 351 4659 782

Clean Room

Room: B1E.25
Responsible: Dr.-Ing Stefan Harazim
Telephone: 291
E-Mail: reinraum(at)ifw-dresden.de
Substitute: Dr. Jens Ingolf Mönch
Technical staff: Martin Bauer (645), Barbara Eichler (672), Stephan Rölz (648), Sandra Nestler (672)

Clean room technology and research areas

The development and manufacturing of integrated circuits in microelectronics and sensor technology is necessarily under clean room conditions. The Institute for Integrative Nanosciences (IIN) provides a clean room facility to push forward research in fields of rolled-up nanotech, microelectronics, MEMS, sensor integration and microfluidics.

Overview on the clean room area.
Overview on the clean room area.

Equipment

The clean room is class 5 (according to ISO 14644-1) and covers an area of about 130 m2. We provide opportunities for processing substrates of up to 4” inch with the following equipment:

Lithography:

  • wet chemical clean room workstations
  • several spin coaters (SÜSS Microtec)
  • mask aligners for UV and DUV lithography operating in contact mode (SÜSS Microtec)
  • laser lithographic mask writing tool DWL66 (HIMT)
  • electron beam lithography tool (Hitachi + Raith)
Lithography equipment: (a) mask aligners, (b) mask writing tool and (c) electron beam lithography.
Lithography equipment: (a) mask aligners, (b) mask writing tool and (c) electron beam lithography.

Dry etching and surface treatment:

  • ICP reactive ion etching tool for chlorine and flour chemistry (Oxford Instruments)
  • CAIBE ion beam etching tool (Roth & Rau)
  • low pressure plasma reactors with process gases O2, Ar, SF6, CF4 and H2 (Diener)

Deposition:

  • plasma enhanced atomic layer deposition (PE-ALD) for Al2O3, TiO2 and HfO2 (Oxford Instruments)
  • electron beam evaporation system for metals (Plassys)

Characterization:

  • atomic force microscope (Bruker)
  • several optical microscopes (Olympus)
  • profilometer (Bruker)
  • optical film thickness profiler (Sentech)
  • confocal lasermicroscope (Keyance)
  • scanning electron microscope (Hitachi)
  • probestation (Cascade Microtech)
Selection of characterization tools: (a) optical microscope, (b) profilometer and (c) confocal laser microscope.
Selection of characterization tools: (a) optical microscope, (b) profilometer and (c) confocal laser microscope.

Back-end/packaging

  • wedge bonder (Devoltec)
  • bonder FINEPLACER lambda (finetech)
  • wafer dicing saw (Disco)
(a) bonder for chip assembly, (b) full automated electron beam evaporator for deposition of metals (c), protestation for several applications
(a) bonder for chip assembly, (b) full automated electron beam evaporator for deposition of metals (c), protestation for several applications