Overview about available methods
The following methods are available and can be performed in the department:
- (TEM) Transmission Electron Microscopy
- CTEM (Conventional Transmission Electron Microscopy)
- ED (Electron Diffraction)
- HRTEM (High Resolution Transmission Electron Microscopy)
- STEM (Scanning Transmission Electron Microscopy)
- EDX (Energy Dispersive X-ray spectrometry)
- EELS (Electron Energy Loss Spectrometry)
- EFTEM (Energy Filtered Transmission Electron Microscopy)
- SEM (Scanning Electron Microscopy)
- WDX (Wave Length Dispersive Spectroscopy
- EDX (Energy Dispersive X-ray Spectroscopy)
- EBSD (Electron Back-Scatter Diffraction)
- FIB Focussed Ion Beam
- Imaging with Ions
- Structuring with Ions
- Local Deposition of Metal Films by Ions and Electrons (EBID & IBID)
- Deposition of Films with the Clustertool CARMEN
- DC magnetron co-sputtering of metals
- HF magnetron sputtering of metals and barrier films
- HF magnetron sputtering of insulators
- E-beam evaporation of metals
- Measurement of Layer Thicknesses (Optical & Mechanical & Analytical)
- Life Time Measurements of Electronic Devices
- Electrical Resistance Measurements
- Surface Analysis
- AFM
- Nanomanipulation (in LM, SEM, FIB, TEM)
- Measuring strength of ductile thin films