The sample is a test structure for electromigration experiments (Blech test).
It consists of Cu(Ag) alloy conductor lines embedded in Si oxide insulation with a Ta diffusion barrier.
Maps
The gray images are secondary electron micrographs used for zooming to the analysis position (left column) and controlling sample drift (upper middle).
The colored images are elemental distribution maps over the area shown in the upper right image (Magnification 20000x).
The element name and the energy of the corresponding Auger peak are displayed above the image.
The images shows the intensity of the peak above its background using a 256 level false color scale.
Lines
The right column shows the result of line profile measurements along the marked line.
For the elements of interest spectra are recorded at every point of the line.
In the middle row the elemental concentrations are shown (128 points).
The profile for Ta (256 points, lower row) shows the Ta diffusion barrier surrounding the Cu lines.
The apparent barrier width of 220 nm is determined by the diameter of the electron beam, the true width is 20 nm.
