Micro- & nanolithography:

e-Beam-Lithography (Raith Voyager- & eLine Plus EBL), various optical mask- & maskless aligners (Heidelberg MLA100, Süss MA6)

Thin film deposition:

PE-ALD (oxides: Al₂O₃, SiO₂, HfO₂, …), PE-CVD (Si₃N₄, SiO₂, SiC, aSi, 2D-materials), spin coating photo resists & polymers
PVD (e-Beam deposition Cr, Au, Ti, Al, Ag, Ni, Co, … & sputtering)

Dry etching:

ICP-RIE (Cl + F, cryo etching, BOSCH), Ar-IBE (multi-layer etching), XeF₂ (high selective Si, Ge etching), reactive plasma (O₂, SF₆, H₂)

Substrates & Sample treatment:

Substrates/wafers: Si, Si/SiO₂, SiO₂, glass wafer - dicing, cleaning, annealing, wet etching, wire bonding

Sample characterization:

Film thickness & stress (ellipsometry, profilometer), SEM, FIB, AFM, optical microscopes (2D, 3D), probe stations