The installation of the new Oxford Instruments process devices is ongoing.
It is a new ICP RIE with atomic layer etching (ALE) option for Chlorine and Fluorine plasma processes, cryogenic temperature capability and optical spectrometer plasma analysis.
The other device is a new PE-CVD for high temperatures up to 1200°C and precursor feed.
The system is made for standard Si-based layers like Si3N4, SiO2, SiC, aSi and for 2D-materials like MoS2 or WS2.
Completion of the installation works and start-up is planned for the end of May 2024.
