

The deposition machine CARMEN is a versatile tool for various deposition techniques.
Chamber in the middle = handler for transfer and with three measurement stages (optical layer thickness, electrical sheet resistance method in construction)
Chamber 1 = load lock with hot carrier system (heating in all chambers except chamber 6)
Chamber 2 = ion beam pretreatment (Mark I+ Kaufman-type ion source) for surface preclean and etch applications with high-current, low-energy ions
Chamber 3 = DC magnetron co-sputtering of metallizations (Cu, Al, Ag, Ti, W, Co, Fe, Ni, Zr)
Chamber 4 = HF magnetron sputtering (reactive) of metallizations and barriers (Ti, Ru, Ta5Si3, TaSiN)
Chamber 5 = HF magnetron sputtering (reactive) of insulators (SAW-grade SiO2)
Chamber 6 = e-beam evaporation (Cu, Al, Ag, Au, Ti)
Information from Equipment & Facilities from Micro/Nano Structures at Structure Analysis
| Name of contact person | group/department | telephone number | email address |
| Dr. Thomas Gemming | Structure Analysis | -298 | T.Gemming(at)ifw-dresden.de |