The following methods are available and can be performed in the department:

• (TEM) Transmission Electron Microscopy
  • CTEM (Conventional Transmission Electron Microscopy)
  • ED (Electron Diffraction)
  • HRTEM (High Resolution Transmission Electron Microscopy)
  • STEM (Scanning Transmission Electron Microscopy)
  • EDX (Energy Dispersive X-ray spectrometry)
  • EELS (Electron Energy Loss Spectrometry)
  • EFTEM (Energy Filtered Transmission Electron Microscopy)
• SEM (Scanning Electron Microscopy)
  • WDX (Wave Length Dispersive Spectroscopy
  • EDX (Energy Dispersive X-ray Spectroscopy)
  • EBSD (Electron Back-Scatter Diffraction)
• FIB Focussed Ion Beam
  • Imaging with Ions
  • Structuring with Ions
  • Local Deposition of Metal Films by Ions and Electrons (EBID & IBID)
• Glow Discharge Optical Emission Spectrometry (GD-OES)
• Surface Analysis
  • XPS
  • AR-XPS
  • AES (Auger Electron Spectrometry)
  • SIMS
• Nanomanipulation (in LM, SEM, FIB, TEM)
• Deposition of Films with the Clustertool CARMEN
  • DC magnetron co-sputtering of metals
  • HF magnetron sputtering of metals and barrier films
  • HF magnetron sputtering of insulators
  • E-beam evaporation of metal